#VU77859 Memory corruption in Qualcomm products - CVE-2023-21637

Vulnerability identifier: #VU77859

Vulnerability risk: Low

CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:H/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear

CVE-ID: CVE-2023-21637

CWE-ID: CWE-119

Exploitation vector: Local access

Exploit availability: No public exploit available

Vulnerable software:
AQT1000
FastConnect 6200
FastConnect 6800
FastConnect 6900
QCA6310
QCA6320
QCA6391
QCA6420
QCA6426
QCA6430
QCA6436
QCA6574A
QCA6595AU
QCA6696
SA6145P
SA6150P
SA8145P
SA8150P
SA8155P
SA8195P
SD865 5G
Snapdragon 835 Mobile PC Platform
Snapdragon 855 Mobile Platform
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon 865 5G Mobile Platform
Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
Snapdragon 870 5G Mobile Platform (SM8250-AC)
Snapdragon Auto 5G Modem-RF
Snapdragon W5+ Gen 1 Wearable Platform
Snapdragon Wear 4100+ Platform
Snapdragon X55 5G Modem-RF System
Snapdragon XR2 5G Platform
SW5100
SW5100P
WCD9335
WCD9340
WCD9341
WCD9360
WCD9380
WCN3610
WCN3660B
WCN3680B
WCN3980
WCN3988
WCN3990
WSA8810
WSA8815
WSA8830
WSA8835
QCA6574AU
SA6155P
SD835
SD855
SDX55
SXR2130

Software vendor:
Qualcomm

The vulnerability allows a local privileged application to execute arbitrary code.

The vulnerability exists due to improper input validation in Linux. A local privileged application can execute arbitrary code.

Install security update from vendor's website.

• https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2023-bulletin.html